P R E L I M I N A R Y
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory
products in FBGA packages.
Flash memory devices in FBGA packages may
be damaged if exposed to ultrasonic cleaning
methods. The package and/or data integrity
may be compromised if the package body is
exposed to temperatures above 150°C for pro-
longed periods of time.
V
CC
speed
= 3.0 volt-only single power supply
(see Product Selector Guide for
options and voltage supply
tolerances)
V
SS
NC
= Device ground
= Pin not connected internally
Logic Symbol
19
A0–A18
DQ0–DQ15
(A-1)
CE#
OE#
WE#
RESET
BYTE#
RY/BY#
16 or 8
Pin Configuration
A0–A18
= 19 addresses
DQ0–DQ14= 15 data inputs/outputs
DQ15/A-1 = DQ15 (data input/output, word
mode),
A-1 (LSB address input, byte
mode)
BYTE#
CE#
OE#
WE#
RESET#
RY/BY#
= Selects 8-bit or 16-bit mode
= Chip enable
= Output enable
= Write enable
= Hardware reset pin, active low
= Ready/Busy# output
January 21, 2005 Am29LV800D_00_A4_E
Am29LV800D
7
AMD [ ADVANCED MICRO DEVICES ]
