AME
AME41-ADJ
n
Thermal Information
Parameter
Package
SOT-23
Thermal Resistance*
(Junction to Case)
TO-92-3
SOP-8
SOT-23
Thermal Resistance
(Junction to Ambient)
TO-92-3
SOP-8
SOT-23
Internal Power Dissipation
TO-92-3
SOP-8
Maximum Junction Temperature
Solder Iron (10 Sec)**
Shunt Bandgap Voltage Reference
Die Attach
Non-Conductive
Epoxy
Conductive
Epoxy
Non-Conductive
Epoxy
Conductive
Epoxy
Non-Conductive
Epoxy
Conductive
Epoxy
Symbol
Maximum
140
Unit
θ
JC
80
60
280
o
C/W
θ
JA
150
150
400
o
C/W
P
D
625
810
150
350
mW
o
C
C
o
*
Measure
θ
JC
on center of molding compound if IC has no tab.
** MIL-STD-202G 210F
n
Electrical Specifications
Unless otherwise specified, T
A
= 25
O
C, I = 100µA
Parameter
Reference Voltage,
±0.5%
Minimum Current
Reference Voltage Change
With Current
ADJ Pin Current
Reference Voltage Temp.
Coeff.
Symbol
V
REF
I
MIN
dV
REF/I
I
ADJ
V
REFTC
0
o
C < T
A
< 70
o
C
I
MIN
< I < 1mA
1mA < I < 20mA
1.5
4
20
100
Test Condition
T
A
= 25
o
C, I
REF
= 100µA
Min
Typ
Max
Units
V
µA
mV
8
nA
ppm/
o
C
1.244 1.250 1.256
30
3
6
Rev.G.03
AME [ ANALOG MICROELECTRONICS ]
