AMIS-710409-A4: 400dpi CIS Module
Data Sheet
1.0 General Description
The AMIS-710409-A4 (PI409MC-A4) is a contact image sensor (CIS) module. It is a long CIS module that uses MOS image sensor
technology for high-speed performance and high sensitivity. Its four parallel video outputs give the AMIS710409-A6 its high speed
performance. The AMIS-710409-A4 is suitable for scanning A4 size (216mm) documents with 15.8 dots per millimeter (dpi) resolution.
Applications include document scanning, mark readers, gaming and office automation equipment.
2.0 Key Features
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Light source, lens and sensor are integrated into a single module
Ultra high speed
Four parallel analog video outputs clocked at 5.0MHz
180usec/line scanning speed @ 5.0MHz clock speed
15.8dpm resolution, 216mm scanning length
Wide dynamic range
Red light source 660nm
Standard A4 size
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14mm x 19mm x 232mm
Low power
Light weight
3.0 Functional Description
The AMIS-710409-A4 imaging module consists of 27 AMIS-720442 (PI3042) imaging chips, produced by AMIS. The sensor chips are
monolithic devices with 128 photo sensing elements. Twenty seven of these imaging chips are cascaded to provide a 3456 photo-
elements module. The AMIS-720442 chips are integrated with the associated multiplex switches of the photo sensors, a digital shift
register and a chip selection switch. The shift register sequentially clocks out the integrated image charges from each of the sensing
elements and passes them through the chip-select switch and out onto the video line. The chip-select switches are sequentially
switched as each predecessor chip completes its scan. These 27 sensors, bonded on a PCB, are grouped into four sub-cascaded
sections. Each contiguously cascaded chip section is connected on separate video lines, therefore providing four video outputs,
VOUT1, VOUT2, VOUT3, and VOUT4. Before the signal charges from the four video lines appear at their respective outputs, they are
converted to signal voltages by four on-board buffer amplifiers; one for each of its corresponding video section. The first three sections,
VOUT1, VOUT2 and VOUT3 have seven sensor chips, while the VOUT4 has six sensor chips. Since each sensor chip has 128 pixels,
there are a total of 3456 pixels (see Figure 1).
Mounted in the module housing along with the PCB, is a one-to-one graded indexed micro lens array, which focuses image of the
scanned documents onto the sensing line of the sensor chips. The third major component mounted in the module is the LED light
source (see Figure 2). The pictorial cross section shows the LED bar light source and its Illumination path as it reflects the image from
the document and focuses through the ROD lens onto the image sensing line of the sensing chips. All components are housed in a
small plastic housing, which has a cover glass. This cover glass also serves as the window. It is the focal point for the object being
scanned and protects all of the critical components within the housing from dust. I/O to the module is a 12-pin connector located on one
end of the module (see Figure 5).
AMI Semiconductor
– July 06, M-20594-001
www.amis.com
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AMI [ AMI SEMICONDUCTOR ]
