AMIS-720442-A: 400dpi Contact Image Sensor
Data Sheet
1.0 Description
AMI Semiconductor’s AMIS-720442-A (PI3042A) contact image sensor (CIS) is a 400 dots per inch (dpi) linear array image sensor
chip. The sensor chip is processed using a CMOS image sensing technology, belonging to AMIS. Designed for cascading multiple
chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB). This
bonding process allows the manufacturers to produce variable CIS module lengths in increments of chip array lengths. This allows a
wide variety of image reading widths which are easily applied to the numerous document scanners found in facsimile, as well as the
narrow width scanners, such as, those found in check reader, lotto tickets, entrance gates tickets, etc. Included in this list of scanners
are various types of automated office equipment which require a wide variety of scanning widths.
multiplexing switches, buffers and a chip selector. The detector's element-to-element spacing is approximately 62.5µm. The size of
each chip without scribe lines is 8080µm by 385µm. Each sensor chip has seven bonding pads. The pad symbols and functions are
described in Table 1.
8080
m
Row of 128 Sensors
and Video Signal
Multiplexers
Readout Shift Register
385
m
Buffer
SP
Buffer
CP
VDD DGND
Chip
Select
IOUT
Buffer
AGND EOS
Figure 1: AMIS-720442-A Block Diagram
Table 1: Pad Symbols and Functions
Symbol
Function
SP
Start pulse: input clock to start the line scan
CP
Clock pulse: input clock to clock of the shift register
VDD
Positive supply: +5V supply connected to substrate
DGND
Digital ground: connection topside common
IOUT
Signal current output: output for video signal current
AGND
Analog ground: connection topside common
EOS
End-of-scan pulse: output from the shift register at end-of-scan
AMI Semiconductor
– May 06, M-20571-001
www.amis.com
1
AMI [ AMI SEMICONDUCTOR ]
