N64S0818HDA/N64S0830HDA
Advance Information
AMI Semiconductor, Inc.
8-Lead Plastic Thin Shrink Small Outline, 4.4 mm TSSOP
E
E1
p
D
B
α
A2
A1
A
c
φ
β
L
Parameter
Sym
Min
Nom
Max
Pin Pitch
Overall height
Molded Package Thickness
Standoff
p
A
A2
A1
E
E1
D
L
0.65
1.10
0.95
0.15
6.50
4.50
3.10
0.70
8
0.85
0.05
6.25
4.30
2.90
0.50
0
0.90
0.10
6.38
4.40
3.00
0.60
4
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
φ
Lead Thickness
Lead Width
c
B
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Mold Draft Angle Top
α
β
Mold Draft Angle Bottom
0
5
10
Note:
1. All dimensions in Millimeters
2. Package dimensions exclude mold flash and protusions.
14
This is a developmental specification and is subject to change without notice.
AMI [ AMI SEMICONDUCTOR ]
