data sheet
Features:
LAMINATE
CABGA/CTBGA/CVBGA
Cutting edge technology and expanding
package offerings provide a platform from
prototype-to-production.
• Full, in-house design
• Square or rectangle packages available
• 4 mm to 21 mm body size available
• 8 to 449 ball counts
• 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available
• JEDEC MO-216 compliant for 0.8 mm and
1.0 mm ball pitch
• JEDEC MO-195 compliant for 0.5 mm & 0.65 mm
ball pitch
• PB free and Green package available
• Daisy Chain packages available
• Short traces for excellent electrical inductance
• Low inductance (modeled data)
1.4nH (1.0 mm trace length)
4.1nH (5.0 mm trace length)
Theta JA at 1.0 Watt and 0 airflow (°C/Watt)
CABGA
CTBGA
CVBGA
8x8
37.28
36.45
37.52
10 x 10
19.86
29.04
26.7
11 x 11
29
N/A
N/A
15 x 15
20.1
N/A
N/A
19 x 19
17.04
N/A
N/A
Amkor assures reliable performance by
continuously monitoring key indices:
• Moisture sensitivity JEDEC Level 2 @ 240 °C
characterization
JEDEC Level 3 @ 260 °C
85 °C/85% RH, 168 hours
• Temp/humidity
85 °C/85%, 1000 hours
• High temp storage
150 °C, 1000 hours
• HAST
130 °C/85% RH, 96 hours
• Temp cycle
-55/+125 °C, 1000 cycles
ChipArray® Packages:
Amkor’s ChipArray® packages are laminate-
based Ball Grid Array (BGA) packages that are
compatible with established SMT mounting
processes. The near-chip-size standard outlines
offer a broad selection of ball array pitch, count,
and body sizes. (See table on back.) In addition
to the standard core ChipArray package (CABGA),
Amkor offers thin core ball grid array packages
(CTBGA and CVBGA) which, coupled with a thin
mold cap, achieve package thicknesses down to
1.0 mm max. By utilizing a thin core laminate,
much denser routing can be achieved, thereby
enabling more I/Os in a given footprint. Amkor
ChipArray packages, regardless of body size and
thickness, utilize the same, flexible capacity which
assures economical packaging solutions. Further,
high volume processes and innovative design
assure high quality and cutting edge technology.
Due to their small size and I/O density, Amkor’s
ChipArray product family is an excellent choice for
new devices requiring a small footprint size and
low mounted height.
Applications:
The ChipArray package family is applicable for
semiconductors such as memory, analog, ASICs,
RF devices and simple PLDs requiring a smaller
package size than conventional PBGAs.
ChipArray packages fill the need for low cost,
minimum space and high speed requirements
of mobile phones and pagers, notebook and
subnotebook personal computers, PDAs and
other wireless systems.
Thermal Resistance:
Reliability:
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS550N
Rev Date: 01’07
AMKOR [ AMKOR TECHNOLOGY ]
