data sheet
Ceramic Land Grid Array
Package (CLGA)
This surface mount package is the same as the
Ceramic Pin Grid Array, except that the pins are
replaced by pads. This package consists of a
co-fired ceramic base that has a matrix of pads on
the bottom of the base. The lid for this package
can be either ceramic "frit sealed" or metal "solder
sealed". This IC package technology allows
application and design engineers to maximize the
performance characteristics of semiconductors
(silicon & GaAs). CLGAs are designed for low
inductance, enhanced thermal operation and
capability. Custom performance enhancements are
available for significant improvements in electrical
response demanded by advancing electronics.
Applications:
Semiconductor technologies find enhanced
performance by using the integrated design
features of the CLGA package. Microprocessors /
controllers, ASICs, Gate Arrays, memory, DSPs and
PC chip sets find the CLGA family to be an ideal
package. Applications requiring improved thermal
performance and high-speed performance such as
desk PCs, laptop PC's, and other similar products
benefit from the CLGA attributes.
Features:
CERAMIC
/
HERMETIC
CLGA
The CLGA offers a variety of feature. From
innovative designs and expanding package
offerings, Amkor provides a platform from
prototype-to-production.
•
Flexible land grid array lead counts
•
Variety of body sizes
•
50 mil staggered & 100 mil matrix land
•
•
•
•
grid pitch
Heat plate / heat slug / heat sink
Exceptional thermal and electrical
performance by design
Multi-layer, ground / power
Cavity package
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS803
Rev Date: 08’02
AMKOR [ AMKOR TECHNOLOGY ]
