data sheet
Ceramic Multi-Chip Module
Package (CMCM)
The MCM/CBGA and MCM/PBGA by Amkor
Technology incorporates the latest technology in
high-density Ceramic and Plastic IC packaging.
The high-speed performance and thermal
advantages of the CBGA and PBGA package
provide the platform for increased enhancement
for mixed semiconductor technologies such as:
Analog/Digital, bipolar/CMOS, ASIC, DSP, etc. in a
single IC package.
Applications:
This MCM technology allows existing and
presently available ICs to be designed in a single,
space-saving, low-cost system package.
MCM-CBGAs and MCM-PBGAs provide the features
required by laptops, portables, sub-notebooks,
telecomm, wireless, PC cards and other
applications.
Features:
CERAMIC
/
HERMETIC
CMCM
The MCM-CBGA offer a variety of features:
•
•
•
•
•
•
•
•
•
•
•
Improved thermal performance
Superior electrical performance
Controlled impedance
Very low design and tooling cost
Electroless Au (gold) plating process
Standard and custom ball counts available
Eutectic solder balls
Flexible circuit designs
Advanced in-house design capability
Versatile substrate routing
Choice of package body sizes
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS804
Rev Date: 08’02
AMKOR [ AMKOR TECHNOLOGY ]
