data sheet
Ceramic Quad Flat Pack
Package (CQFP)
Amkor Technology is continuing to service this
established industry package. The Amkor
Technology CQFP capability provides you, the
customer, with a wide range of lead counts and
body sizes available from various suppliers. The
CQFP is a hermetic package consisting of two
pieces of dry pressed ceramic surrounding a
"gullwing" formed leadframe. The ceramic / LF /
ceramic system is held together hermetically by
glass. The frit lid is sealed/reflowed over the
package cavity at temperatures between
400° - 460° Centigrade.
Applications:
Along with the other standard industry packages,
the CQFP has a proven track record and is still
being used by semiconductor technologies such as:
Digital to Analog converters, Microwave, Logic,
Memory, Microcontrollers, and Video controllers.
Some end applications are: Military electronics,
Commercial electronics, Automotive and
Telecommunications.
Features:
CERAMIC
/
HERMETIC
CQFP
The CQFP offers a variety of features:
• Square package body
• 14-256 lead count, 25-50 mil lead pitch's
• Hermetic package
• High thermal conductive ceramic
• Solder Plate lead finish
• JEDEC standard compliant
• Wide selection of available cavity sizes to
meet most die size needs
• Commercial or full Military flows
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS806
Rev Date: 08’02
AMKOR [ AMKOR TECHNOLOGY ]
