data sheet
Ceramic Shrink Small Outline
Package (CSSOP)
This is a ceramic version of the Plastic SSOP
package. The CSSOP is a hermetic package
consisting of two pieces of dry pressed ceramic
surrounding a "gullwing" formed leadframe. This
package has leads extending from two sides of the
package (dual). The ceramic / LF / ceramic system
is held together hermetically by glass. The frit lid
is sealed/reflowed over the package cavity at
temperatures between 400° - 460° Centigrade.
Applications:
These packages enable end products (pagers,
portable audio / video, disc drives, radio, RF
devices / components, telecom) to be reduced in
size and weight. Semiconductor families such as
operational amplifiers, drivers, optoelectronics,
controllers, logic, analog, memory, comparators
and more using BiCMOS, CMOS or other
silicon/GaAs technologies are well addressed by
Amkor's CSSOP product family.
Features:
CERAMIC
/
HERMETIC
CSSOP
The CSSOP offers a variety of features:
• 20 & 24 lead counts (Others available when tooled)
• 150 mil body size (Others available when tooled)
• Hermetic package
• High thermal conductive ceramic
• Matte Tin Plate lead finish
• JEDEC and EIAJ package outline standard compliant
• Wide selection of cavity sizes to meet most
die size needs
• Commercial or full Military flows
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS808
Rev Date: 08’02
AMKOR [ AMKOR TECHNOLOGY ]
