data sheet
MQFP
Features:
LEADFRAME
Metric Quad Flat
Pack (MQFP)
Packages:
Amkor’s MQFP package portfolio enables
the designer, specifier or systems engineer
the flexibility of growing or shrinking IC
package size based upon application need.
Amkor employs the most up-to-date,
advanced equipment, material and
processes to assure successful, reliable
performance of your IC chips. Having a
complete line of MQFPs available and at
your disposal means security and conven-
ience. Sourcing them from Amkor means
success.
Thermal
Enhancement:
Some designs and applications require an
added margin of thermal performance
(power). Amkor’s easy and cost-effective
solution is a heatspreader. This optional
embedded thermal aid improves Theta JA
by greater than 15% (without external
heatsinks or fans) by increasing the heat
dissipation path from the IC chip to the
PCB.
Applications:
Amkor’s MQFP line is adapted to meet the
increasing challenges of advancing proces-
sors/controllers, DSP, ASIC, video-DAC, PC
chip-sets, gate arrays, logic, multi-media
and other technologies. These packages fill
many end application needs in consumer,
commercial, office, automotive, PC, indus-
trial and other product areas.
Amkor’s MQFP IC package portfolio provides:
• 10 x 10 mm to 40 x 40 mm body size
• 44 to 304 lead counts
• Hi-conductivity copper leadframes
• Die up and down configurations
• JEDEC standard compliant
• Wide selection of leadframe die pad sizes
• Integrated thermal enhancement
• Heatspreader available
• Custom leadframe design available
• Fine pitch wire bond capability
• Lead free option available
Multi-Layer PCB
Body
Pkg
Size (mm)
44 ld
10 x 10
64 ld
14 x 14
JEDEC Standard Test Boards
Thermal Resistance:
Pad Size
7.4 x 7.4
8.9 x 8.9
Theta JA (°C/W) by Velocity (LFPM)
0
38.4
33.7
200
32.1
27.9
500
29.4
25.5
Multi-Layer PCB
Body
Pkg
Size (mm)
**44 ld
10 x 10
**64 ld
14 x 14
*100 ld
14 x 20
*208 ld
28 x 28
*240 ld
32 x 32
*304 ld
40 x 40
* Pre-JEDEC Standard Test Boards
** JEDEC Standard Test Boards
Pad Size
7.4 x 7.4
8.9 x 8.9
11.0 x 11.0
11.0 x 11.0
12.7 x 12.7
11.0 x 11.0
Theta JA (°C/W) by Velocity (LFPM)
0
37.5
32.7
27.3
25.7
24.5
26.8
200
31.8
27.4
23.5
22.6
21.8
24.0
500
29.4
25.1
21.6
20.9
20.5
22.5
Electrical:
Pkg
44 ld
Body Size
(mm) Lead
10 x 10 Longest
Shortest
Inductance
(nH)
1.660
1.460
Capacitance
(pF)
0.322
0.342
Resistance
(mΩ)
19.8
17.0
Simulated Results @ 100 MHz
Reliability:
Amkor’s MQFPs are reliability assured through optimized design, material
and process enabling high performance operation of your IC chip.
• Moisture Sensitivity
Characterization
• PCT
• Temp cycle
• Temp/Humidity
• High temp storage
JEDEC Level 3
30 °C/60% RH, 192 hours
121 °C /100% RH/2 atm., 504 hours
-65/+150 °C, 1000 cycles
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS250G
Rev Date: 09’02
AMKOR [ AMKOR TECHNOLOGY ]
