AS1153/55
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sec-
tions of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
V
CC
to GND
INx+, INx- to GND
OUTx to GND
Thermal Resistance
Θ
JA
Storage Temperature Range
Maximum Junction Temperature
Operating Temperature Range
-40
-65
Min
-0.3
-0.3
-0.3
Max
+5.0
+5.0
V
CC
+ 0.3
128
+150
+150
+85
Units
V
V
V
ºC/W
ºC
ºC
ºC
The reflow peak soldering
temperature (body temperature)
specified is in compliance with
IPC/JEDEC J-STD-020C
“Moisture/ Reflow Sensitivity
Classification for Non-Hermetic
Solid State Surface Mount
Devices”.
Human Body Model, INx+, INx-
Typical 4-layer application
Notes
Package Body Temperature
+260
ºC
ESD Protection
-4
+4
kV
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