AS1323
Data Sheet
10 Package Drawings and Markings
The device is available in an TSOT23-5 package.
Figure 13. TSOT23-5 Package
Symbol
A
A1
A2
b
b1
c
c1
D
E
E1
e
e1
Notes:
Min
0.01
0.84
0.30
0.31
0.12
0.08
Typ
0.05
0.87
0.35
0.15
0.13
2.90BSC
2.80BSC
1.60BSC
0.95BSC
1.90BSC
Max
1.00
0.10
0.90
0.45
0.39
0.20
0.16
Notes
Symbol
L
L1
L2
N
R
R1
Min
0.30
Typ
0.40
0.60REF
0.25BSC
5
Max
0.50
Notes
0.10
0.10
0º
4º
0.25
8º
3,4
3,4
3,4
θ
θ
1
aaa
bbb
ccc
ddd
4º
10º
12º
Tolerances of Form and Position
0.15
0.25
0.10
0.20
1. Dimensioning and tolerancing conform to
ASME Y14.5M - 1994.
2. Dimensions are in millimeters.
3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall
not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or pro-
trusion shall not exceed 0.15mm per side. Dimensions D and E1 are determined at datum H.
4. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outer-
most extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
include any mistmatches between the top of the package body and the bottom. D and E1 are determined at
datum H.
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