AS1369
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Input Supply Voltage
Shutdown Input Voltage
Output Voltage
IOUT
Min
-0.3
-0.3
-0.3
Max Units
Comments
+7
+7
+7
V
V
V
Short-circuit protected.
Input/Output Voltage1
-0.3
+7
V
Power Dissipation 2
360
mW
Internally limited. Mounted on PCB.
Operating Junction Temperature
Storage Temperature Range
-40
-65
+125
+150
2
ºC
ºC
kV
V
HBM MIL-Std. 883E 3015.7 methods
CDM JESD22-C101C methods
JEDEC 78
ESD
500
+100
Latch-Up
-100
mA
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020C “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
Package Body Temperature
+260
ºC
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
1. The output PNP structure contains a diode between pins VIN and VOUT that is normally reverse-biased. revers-
ing the polarity of pins VIN and VOUT will activate this diode.
2. The maximum allowable power dissipation is a function of the maximum junction temperature (TJ(MAX), the
junction-to-ambient thermal resistance (ΘJA), and the ambient temperature (TAMB). The maximum allowable
power dissipation at any ambient temperature is calculated as:
P(MAX) = (TJ(MAX) - (TAMB))/ΘJA
(EQ 1)
Where:
The value of ΘJA for the WLP package is 345°C/W.
Note: Exceeding the maximum allowable dissipation will cause excessive device temperature and the
regulator will go into thermal shutdown.
The AS1369 uses an internal protective structure against light influence. However, exposing the WLP package to
direct light could cause device malfunction.
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