AS1970
Data Sheet - Package Drawings and Markings
Figure 24. 8-pin MSOP Package
Symbol
A
Typ
1.10
0.10
0.86
3.00
2.95
4.90
3.00
2.95
0.51
0.51
0.15
0.15
0.31
0.41
±Tol
Max
Symbol
Typ
0.33
±Tol
+0.07/-0.08
±0.05
b
b1
c
A1
A2
D
±0.05
0.30
±0.08
0.18
±0.05
±0.10
c1
0.15
+0.03/-0.02
±3.0º
D2
E
±0.10
3.0º
θ1
θ2
θ3
L
±0.15
12.0º
±3.0º
E1
E2
E3
E4
R
±0.10
12.0º
±3.0º
±0.10
0.55
±0.15
±0.13
L1
aaa
bbb
ccc
e
0.95 BSC
0.10
–
–
–
–
–
–
±0.13
+0.15/-0.08
+0.15/-0.08
±0.08
0.08
R1
t1
0.25
0.65 BSC
0.525 BSC
t2
±0.08
S
Notes:
1. All dimensions are in millimeters and all angles in degrees (unless otherwise noted).
2. Datums B and C to be determined at datum plane H.
3. Dimensions D and E1 are to be determined at datum plane H.
4. Dimensions D2 and E2 are for the top package; dimensions D and E1 are for the bottom package.
5. Cross section A-A to be determined at 0.13 to 0.25mm from the leadtip.
6. Dimensions D and D2 do not include mold flash, protrusion, or gate burrs.
7. Dimensions E1 and E2 do not include interlead flash or protrusion.
www.austriamicrosystems.com
Revision 1.02
15 - 18