HELP3 Dual-band Cellular/PCS UMTS
3.4 V HSPA Linear Power Amplifier Module
TM
AWT6221R
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FEATURES
DATA SHEET - Rev 2.3
InGaP HBT Technology
High Efficiency:
19 % @ +16 dBm P
OUT
40 % @ maximum P
OUT
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Low Quiescent Current: 8 mA
Internal Voltage Regulation
Common V
MODE
Control Line
Simplified V
CC
Bus PCB routing
Reduced External Component Count
Low Profile Surface Mount Package: 1 mm
HSDPA Compliant
RoHS Compliant Package, 250
o
C MSL-3
WCDMA/HSPA Dual-Band Cell/PCS Wireless
Handsets and Data Devices
AW
T
622
1
R
APPLICATIONS
M28 Package
14 Pin 3 mm x 5 mm x 1 mm
Surface Mount Module
The AWT6221R addresses the demand for increased
integration in dual-band handsets for North American
UMTS network deployments. The small footprint 3
mm x 5 mm x 1 mm surface mount RoHS compliant
package contains independent RF PA paths to ensure
optimal performance in both frequency bands, while
achieving a 25% PCB space savings compared with
solutions requiring two single-band PAs. The package
pinout was chosen to enable handset manufacturers
to easily route V
CC
to both power amplifiers and
simplify control with a common V
MODE
pin. The
device is manufactured on an advanced InGaP HBT
MMIC technology offering state-of-the-art reliability,
temperature stability, and ruggedness. The AWT6221R
incorporates ANADIGICS’ HELP3™ technology to
provide low power consumption without the need for
an external voltage regulator. Two operating modes
provide optimum efficiency at high and medium/low
power output levels, thereby dramatically increasing
handset talk-time and standby-time. Its built-in voltage
regulator eliminates the need for external voltage
regulation and load switches. The 3 mm x 5 mm x 1
mm surface mount package incorporates matching
networks optimized for output power, efficiency and
linearity in a 50
Ω
system.
Figure 1: Block Diagram
11/2008
PRODUCT DESCRIPTION
ANADIGICS [ ANADIGICS, INC ]
