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AWT6224RM28P9 参数 Datasheet PDF下载

AWT6224RM28P9图片预览
型号: AWT6224RM28P9
PDF下载: 下载PDF文件 查看货源
内容描述: HELP3TM双频段900兆赫/ UMTS IMT 3.4 V HSPA线性功率放大器模块 [HELP3TM Dual-band 900 MHz/IMT UMTS 3.4 V HSPA Linear Power Amplifier Module]
分类和应用: 放大器射频微波功率放大器
文件页数/大小: 8 页 / 359 K
品牌: ANADIGICS [ ANADIGICS, INC ]
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HELP3 Dual-band 900 MHz/IMT UMTS
3.4 V HSPA Linear Power Amplifier Module
TM
AWT6224R
Data Sheet - Rev 2.2
FEATURES
InGaP HBT Technology
High Efficiency:
20 % @ +16 dBm P
OUT
(without DC/DC Converter)
40 % @ maximum P
OUT
AW
T
Low Quiescent Current: 8 mA
Internal Voltage Regulation
Common V
MODE
Control Line
Simplified V
CC
Bus PCB routing
Reduced External Component Count
Low Profile Surface Mount Package: 1 mm
HSDPA Compliant
RoHS Compliant Package, 250
o
C MSL-3
WCDMA/HSPA 900/IMT Dual-Band Wireless
Handsets and Data Devices
622
4R
APPLICATIONS
M28 Package
14 Pin 3 mm x 5 mm x 1 mm
Surface Mount Module
GND
at
slug
(pad)
V
EN_900
1
Bias
Control
14
GND
The AWT6224 addresses the demand for increased
integration in dual-band handsets for EGSM network
deployments. The small footprint 3 mm x 5 mm
x 1 mm surface mount RoHS compliant package
contains independent RF PA paths to ensure optimal
performance in both frequency bands, while achieving
a 25% PCB space savings compared with solutions
requiring two single-band PAs. The package pinout
was chosen to enable handset manufacturers
to easily route V
CC
to both power amplifiers and
simplify control with a common V
MODE
pin. The
device is manufactured on an advanced InGaP HBT
MMIC technology offering state-of-the-art reliability,
temperature stability, and ruggedness. The AWT6224
incorporates ANADIGICS’ HELP3™ technology to
provide low power consumption without the need for
an external voltage regulator. Two operating modes
provide optimum efficiency at high and medium/low
power output levels, thereby dramatically increasing
handset talk-time and standby-time. Its built-in voltage
regulator eliminates the need for external voltage
regulation and load switches. The 3 mm x 5 mm x 1
mm surface mount package incorporates matching
networks optimized for output power, efficiency and
linearity in a 50
system.
PRODUCT DESCRIPTION
RF
IN_900
2
13
RF
OUT_900
V
MODE1
3
12
V
CC
V
BATT
4
11
V
CC
A
V
MODE2
(N/C)
5
10
GND
RF
IN_IMT
6
Bias
Control
9
GND
V
EN_IMT
7
8
RF
OUT_IMT
GND
Figure 1: Block Diagram
11/2008