HELP2
FEATURES
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TM
AWS/KPCS CDMA 3.4V/28dBm
Linear Power Amplifier Module
Data Sheet - Rev 2.4
AWT6309
InGaP HBT Technology
High Efficiency:
40 % @ +28 dBm output
22 % @ +17 dBm output
Low Quiescent Current: 15 mA
Low Leakage Current in Shutdown Mode: <1
µA
Internal Voltage Regulation
Optimized for a 50
Ω
System
Low Profile Miniature Surface Mount Package:
1 mm
CDMA 1XRTT, 1xEV-DO Compliant
Pinout Enables Easy Phone Board Migration
From 4 mm x 4 mm Package
RoHS-Compliant Package, 250
o
C MSL-3
CDMA/EVDO AWS/KPCS band Wireless
Handsets and Data Devices
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M9 Package
8 Pin 3 mm x 3 mm x 1 mm
Surface Mount Module
APPLICATIONS
PRODUCT DESCRIPTION
The AWT6309 meets the increasing demands for
higher efficiency and smaller footprint in CDMA
1X handsets. The package pinout was chosen to
enable handset manufacturers to switch from a
4 mm x 4 mm PA module with few layout changes
while reducing board area requirements by 44%. The
AWT6309 uses ANADIGICS’ exclusive InGaP-Plus™
technology, which combines HBT and pHEMT devices
on the same die, to enable state-of-the-art reliability,
temperature stability, and ruggedness. The AWT6309
is part of ANADIGICS’ High-Efficiency-at-Low-Power
(HELP™) family of CDMA power amplifiers, which
deliver low quiescent currents and significantly
greater efficiency without a costly external DAC or
DC-DC converter. Through selectable bias modes, the
AWT6309 achieves optimal efficiency across different
output power levels, specifically at low- and mid-
range power levels where the PA typically operates,
thereby dramatically increasing handset talk-time and
standby-time. Its built-in voltage regulator eliminates
the need for external voltage regulation components.
The 3 mm x 3 mm x 1 mm surface mount package
incorporates matching networks optimized for output
power, efficiency, and linearity in a 50
Ω
system.
05/2009
Figure 1: Block Diagram
ANADIGICS [ ANADIGICS, INC ]
