Dual-band CDMA/PCS 3.4 V/28 dBm
Linear Power Amplifier Module
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AWT6314R
Data Sheet - Rev 2.0
FEATURES
Single Mode Operation: P
OUT
+28 dBm
High Efficiency: 39 %
25 % Package Size Reduction
Common V
MODE
Control Line
Simplified V
CC
Bus PCB routing
Reduced External Component Count
Low Profile Surface Mount Package: 1.1 mm
RoHS Compliant Package, 250
o
C MSL-3
CDMA/EVDO Cell & PCS dual-band Wireless
Handouts and Data Devices
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AW
T
631
4
APPLICATIONS
M23 Package
12 Pin 3 mm x 5 mm x 1 mm
Surface Mount Module
The AWT6314R meets the increasing demands for
higher levels of integration in dual-band CDMA/PCS
1X handsets, while reducing board area requirements
by 25 %. The package pinout was chosen to enable
handset manufacturers to easily route V
CC
to both
power amplifiers and simplify control with a common
V
MODE
pin. The device is manufactured on an advanced
InGaP HBT MMIC technology offering state-of-the-art
PRODUCT DESCRIPTION
reliability, temperature stability, and ruggedness.
Selectable bias modes that optimize efficiency for
different output power levels, and a shutdown mode
with low leakage current, serve to increase handset
talk and standby time. The self contained 3 mm x 5 mm
x 1 mm surface mount package incorporates matching
networks optimized for output power, efficiency and
linearity in a 50
Ω
system.
GND at
slug
(pad)
V
REF_PCS
1
Bias Control
12
RF
OUT_PCS
RF
IN_PCS
2
11
GND
V
CC1
3
V
MODE
4
10
V
CC2
9
V
CC2
A
RF
IN_CELL
5
Bias Control
8
RF
OUT_CELL
V
REF_CELL
6
7
GND
GND
Figure 1: Block Diagram
09/2008