20V P-Channel Power MOSFET
General Description
The AAT8303 is a low threshold P-channel MOS-
FET designed for the battery, cell phone, and PDA
markets. Using AnalogicTech's proprietary ultra-
high-density trench technology and space-saving,
small-outline, J-lead package, performance supe-
rior to that normally found in a larger footprint has
been squeezed into the area of a TSOPJW-8
package.
AAT8303
Features
•
•
•
Drain-Source Voltage (max): -20V
Continuous Drain Current
1
(max):
-10A @ 25°C
Low On-Resistance:
— 14mΩ @ V
GS
= -4.5V
— 24mΩ @ V
GS
= -2.5V
TSOPJW-8 Package
Top View
D
8
D
7
D
6
D
5
Applications
•
•
•
•
Battery Packs
Battery-Powered Portable Equipment
Cellular and Cordless Telephones
Load Switches
Absolute Maximum Ratings
T
A
= 25°C, unless otherwise noted.
Symbol
V
DS
V
GS
I
D
I
DM
I
S
T
J
T
STG
1
S
2
S
3
S
4
G
Description
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @ T
J
= 150°C
1
Pulsed Drain Current
2
Continuous Source Current (Source-Drain Diode)
1
Operating Junction Temperature Range
Storage Temperature Range
T
A
= 25°C
T
A
= 70°C
Value
-20
±12
±10
±8
±48
-2.3
-55 to 150
-55 to 150
Units
V
A
°C
°C
Thermal Characteristics
1
Symbol
R
θJA
R
θJA2
R
θJF
P
D
Description
Junction-to-Ambient Steady State
Junction-to-Ambient t<5 Seconds
Junction-to-Foot
Maximum Power Dissipation
T
A
= 25°C
T
A
= 70°C
Typ
86
44
27
Max
105
54
32
2.3
1.5
Units
°C/W
°C/W
°C/W
W
1. Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 5-second pulse on a
1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. R
θJF
+ R
θFA
= R
θJA
where
the foot thermal reference is defined as the normal solder mounting surface of the device's leads. R
θJF
is guaranteed by design;
however, R
θCA
is determined by the PCB design. Actual maximum continuous current is limited by the application's design.
8303.2005.04.1.0
1
ANALOGICTECH [ ADVANCED ANALOGIC TECHNOLOGIES ]
