Model 1M803S
Rev. C
Micro Xinger
3dB Hybrid Coupler
Description
The 1M803S Micro Xinger® is a low profile, miniature 3dB hybrid coupler in
an easy to use surface mount package designed for U-NII, ISM and
hyperLAN applications. The 1M803S is designed for balanced amplifiers
and signal distribution and is an ideal solution for the ever increasing
demands of the wireless industry for smaller printed circuit boards and high
performance. Parts have been subjected to rigorous qualification testing
and units are 100% tested. They are manufactured using materials with x
and y thermal expansion coefficients compatible with common substrates
such as FR4 and G-10. Produced with 6 of 6 RoHS compliant tin
immersion.
ELECTRICAL SPECIFICATIONS**
Features:
•
5.0 – 6.0 GHz
•
Very Low Loss
•
High Isolation
•
90o Quadrature
•
•
•
•
•
Surface Mountable
Tape And Reel
New Micro-Package
100% Tested
Lead Free
Frequency
GHz
Isolation
dB Min
Insertion
Loss
dB Max
VSWR
Max:1
5.0 – 6.0
Amplitude
Balance
dB Max
20
Phase
Balance
Degrees
0.25
Power
Ave. CW
Watts
1.21
ΘJC
ºC/Watt
Operating
Temp.
ºC
± 0.30
±3
20
78.1
-55 to +85
**Specification based on performance of unit properly installed on microstrip printed circuit
boards with 50
Ω
nominal impedance. Specifications subject to change without notice.
Mechanical Outline
.065
±.007
[1.66
±0.18
]
Pin 1
.400
±.010
[10.16
±0.25
]
Pin 2
GND
.200
±.010
[5.08
±0.25
]
4X .048
±.00
[1.22
±0.
.104
±.004
[2.64
±0.10
]
Denotes
Array Number
.304
±.004
[7.72
±0.10
]
4X .024
±.004
[0.61
±0.10
]
Pin 4
GND
Pin 3
Dimensions are in Inches [Millimeters]
1M803S Mechanical Outline
Tolerances are Non-Cumulative
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 544-2414
+44 2392-232392