Model RFP-50-100RCG
% OF RATED POWER
Flanged Resistors
2
Typical Performance
Power Derating
Suggested Mounting Procedures
.025 MIN.
(2 PLACES)
100
75
50
25
0
25
50
75
100
125
150
BOARD LOWER
THAN LEAD.
BOARD EVEN
WITH LEAD.
BOARD LOWER
THAN LEAD.
BOARD HIGHER
THAN LEAD.
SUGGESTED STRESS RELIEF METHODS
SCALE:
NOT RECOMMENDED APPLICATION
SCALE:
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
2. Drill & tap the heatsink for the appropriate thread size to
be used.
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001” max. thickness).
4. Position device on mounting surface and secure using
socket head screws, flat & split washers. Torque screws to
the appropriate value. Make sure that the device is flat
against the heatsink. (Care should be taken to avoid
upward pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210°C).
CASE TEMPERATURE —
°C
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Voice:
(800) 544-2414
Fax:
(315) 432-9121
Sales Desk Europe:
Voice:
(+44) 23 92 232392
Fax:
(+44) 23 92 251369
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