APA2020
Stereo 2-W Audio Power Amplifier
Features
•
•
•
Depop Circuitry Integrated
Thermal Shutdown Circuitry Integrated
Output Power at 1% THD+N, V
DD
=5V
- 1.8 W/Ch (typ) into a 4
Ω
Load
- 1.2 W/Ch (typ) into a 8
Ω
Load
•
•
•
Bridge-Tied Load (BTL) or Single-Ended
(SE) Modes Operation
Various 24-Pin Power Packages Available
SOP, TSSOP-P
Shutdown Control Mode , I
DD
= 0.5µA
General Description
The APA2020 is a stereo bridge-tied audio power am-
plifier in various 24-pin power packages , including
SOP , TSSOP-P. When connecting to a 5V voltage
supply , the APA2020 is capable of delivering 1.8W/
1.2W of continuous RMS power per channel into 4Ω/
8Ω loads with less than 1% THD+N , respectively.
The APA2020 simplifies design and frees up board
space for other features.
The APA2020 also served well in low-voltage
applications , which provides 800-mW per channel
into 4Ω loads with a 3.3V supply voltage. Both of the
depop circuitry and the thermal shutdown protection
circuitry are integrated in the APA2020 , that reduces
pops and clicks noise during power up and when
using the shutdown or mute modes and protects the
chip from being destroyed by over-temperature
failure.
To simplify the audio system design in notebook
computer applications , the APA2020 combines a
stereo bridge-tied loads (BTL) mode for speaker drive
and a stereo single-end (SE) mode for headphone
drive into a single chip , where both modes are easily
switched by the SE/BTL input control pin signal. For
power sensitive applications , the APA2020 also
features a shutdown function which keeps the supply
current only 0.5 µA (typ).
Applications
•
Stereo Audio Power Amplifier for Notebook
Computer
Ordering and Marking Information
APA2020
L e a d F re e C o d e
H a n d lin g C o d e
Tem p. R ange
P ackage C ode
A P A 2020
XXXXX
A P A 2020
XXXXX
P ackage C ode
K : SOP
R : T S S O P -P *
Tem p. R ange
I : - 4 0 to 8 5
°
C
H a n d lin g C o d e
TU : Tube
TR : Tape & R eel
T Y : T ra y
L e a d F re e C o d e
L : L e a d F re e D e v ic e
B la n k : O rig in a l D e v ic e
X X X X X - D a te C o d e
A P A 2020 K :
A P A 2020 R :
X X X X X - D a te C o d e
* TSSOP-P is a standard TSSOP package with a thermal pad exposure on the bottom of the package.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright
ANPEC Electronics Corp.
Rev. A.8 - Nov., 2002
1
www.anpec.com.tw
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
