APA2020
Pin Description
1
24
23
22
21
GND/HS
GND/HS
2
N C
TJ
ROUT+
3
LOUT+
4
RLINEIN
RHPIN
LLINEIN
5
20
19
LHPIN
Thermal
Pad
LBYPASS
LVDD
RBYPASS
RVDD
6
7
18
17
16
S H U T D O W N
N C
8
9
MUTE OUT
LOUT-
HP/LINE
ROUT-
10
11
12
15
14
13
SE/BTL
MUTE IN
GND/HS
GND/HS
Top View
Bottom View
For TSSOP-P Only
For SOP and TSSOP-P
Pin
I/O
Description
Name
No
GND/HS
1,12,
13,24
Ground connection for circuitry, directly connected to thermal pad
(only in TSSOP-P package).
TJ
2
O
Shutdown mode control signal input, sources a current proportional
to the junction temperature. This pin should be left unconnected
during normal operation. For more information, see the junction
temperature measurement section of this document.
LOUT +
3
4
O
I
Left channel + output in BTL mode, + output in SE mode.
L LINE IN
Left channel line input, selected when HP/
pin (16) is held low.
LINE
5
I
LHP IN
Left channel headphone input, selected when HP/
held high.
pin (16) is
LINE
LBYPASS
LVDD
SHUTDOWN
6
7
8
Connect to voltage divider for left channel internal mid-supply bias.
Supply voltage input for left channel and for primary bias circuits.
Shutdown mode control signal input, places entire IC in shutdown
I
I
mode when held high, IDD= 0.5 A.
µ
MUTE OUT
LOUT -
9
10
O
O
Follows MUTE in pin (11), provides buffered output.
Left channel - output in BTL mode, high-impedance state in SE
mode.
MUTE IN
11
14
15
16
I
I
Mute control signal input, hold low for normal operation, hold high to
mute.
Mode control signal input, hold low for BTL mode, hold high for SE
mode.
Right channel - output in BTL mode, high impedance state in SE
mode.
MUX control input, hold high to select headphone inputs (5,20),
hold low to select line inputs (4,21).
SE/BTL
ROUT-
O
I
HP/
LINE
Copyright ANPEC Electronics Corp.
Rev. A.8 - Nov., 2002
6
www.anpec.com.tw