APL5156
Package Information
SOP-8P
D
SEE VIEW A
D1
THERMAL
PAD
E2
E1
E
h X 45
o
e
b
c
A2
A
A1
0.25
GAUGE PLANE
SEATING PLANE
L
VIEW A
S
Y
M
B
O
L
A
A1
A2
b
c
D
D1
E
E1
E2
e
h
L
0
0.25
0.40
0
o
C
0.00
1.25
0.31
0.17
4.80
2.50
5.80
3.80
2.00
1.27 BSC
0.50
1.27
8
o
C
0.010
0.016
0
o
C
0.51
0.25
5.00
3.50
6.20
4.00
3.00
SOP-8P
MILLIMETERS
MIN.
MAX.
1.60
0.15
0.000
0.049
0.012
0.007
0.189
0.098
0.228
0.150
0.079
0.050 BSC
0.020
0.050
8
o
C
0.020
0.010
0.197
0.138
0.244
0.157
0.118
MIN.
INCHES
MAX.
0.063
0.006
θ
Note : 1. Followed from JEDEC MS-012 BA.
2. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright
©
ANPEC Electronics Corp.
Rev. A.6 - Oct., 2009
13
www.anpec.com.tw
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
