APL5885
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
T
P
(IR/Convection or VPR Reflow)
tp
Critical Zone
T
L
to T
P
Ram p-up
Temperature
T
L
Tsm ax
t
L
Tsm in
Ram p-down
ts
Preheat
25
t 25
°
C to Peak
Tim e
Classificatin Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Large Body
Small Body
Pb-Free Assembly
Large Body
Small Body
3°C/second max.
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
250 +0/-5°C
10-30 seconds
20-40 seconds
Average ramp-up rate
3°C/second max.
(T
L
to T
P
)
Preheat
-
Temperature Min (Tsmin)
100°C
-
Temperature Mix (Tsmax)
150°C
-
Time (min to max)(ts)
60-120 seconds
Tsmax to T
L
- Ramp-up Rate
Tsmax to T
L
-
Temperature(T
L
)
183°C
-
Time (t
L
)
60-150 seconds
Peak Temperature(Tp)
225 +0/-5°C
240 +0/-5°C
Time within 5°C of actual Peak
10-30 seconds
10-30 seconds
Temperature(tp)
Ramp-down Rate
6°C/second max.
6 minutes max.
Time 25°C to Peak Temperature
6°C/second max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright
ANPEC Electronics Corp.
Rev. A.6 - Apr., 2003
9
www.anpec.com.tw
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
