APM2505NU
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
T
P
(IR/Convection or VPR Reflow)
tp
Critical Zone
T
L
to T
P
Ramp-up
Temperature
T
L
Tsmax
t
L
Tsmin
Ramp-down
ts
Preheat
25
t 25
°
C to Peak
Time
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(T
L
to T
P
)
Preheat
-
Temperature Min (Tsmin)
-
Temperature Max (Tsmax)
-
Time (min to max) (ts)
Time maintained above:
-
Temperature (T
L
)
-
Time (t
L
)
Peak/Classificatioon Temperature (Tp)
Time within 5
°
C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
3
°
C/second max.
100
°
C
150
°
C
60-120 seconds
183°C
60-150 seconds
See table 1
10-30 seconds
Pb-Free Assembly
3
°
C/second max.
150
°
C
200
°
C
60-180 seconds
217°C
60-150 seconds
See table 2
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
8
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Copyright
©
ANPEC Electronics Corp.
Rev. B.2 - Oct., 2005
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
