APM3009N
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
Peak temperature
°
183 C
Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/
Convection
3 C/second max.
120 seconds max.
60 ~ 150 seconds
10 ~ 20 seconds
VPR
°
°
°
Average ramp-up rate(183C to Peak)
10 C /second max.
°
Preheat temperature 125
25 C)
°
C
Temperature maintained above 183
Time within 5 C of actual peak temperature
Peak temperature range
°
60 seconds
°
°
° °
215~ 219 C or 235 +5/-0 C
220 +5/-0 C or 235 +5/-0 C
Ramp-down rate
°
°
6 C /second max.
10 C /second max.
°
6 minutes max.
Time 25 C to peak temperature
Package Reflow Conditions
pkg. thickness < 2.5mm and pkg.
volume <
pkg. thickness < 2.5mm and
pkg. thickness
and all bags
≥ 2.5mm
≥
pkg. volume
350 mm
°
°
C
Convection220 +5/-0 C
Convection 235 +5/-0
°
°
VPR 215-219 C
IR/Convection 220 +5/-0C
C
VPR 235 +5/-0
IR/Convection 235 +5/-0 C
°
°
Copyright ANPEC Electronics Corp.
10
www.anpec.com.tw
Rev. A.3 - May., 2002
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
