APM4350KP
Packaging Information
KPAP (Reference JEDEC Registration MS-012)
8
8
7
6
5
F
F1
E1
E
1
2
3
4
1
G
2
3
4
G1
D
a
7
6
5
Dim
A
B
C
D
E
E1
e
F
F1
G
G1
H
K
a
Millimeters
Min.
Max.
1.00
1.20
0.38
0.51
0.19
0.25
4.80
5.00
5.90
6.10
5.696
5.796
1.27 BSC
0.052
0.152
0.352
0.452
0.052
0.152
0.352
0.452
3.491
3.691
1.60
-
0°
12°
C
e
B
A
K
Inches
Min.
Max.
0.039
0.047
0.015
0.020
0.007
0.010
0.189
0.197
0.232
0.240
0.224
0.228
0.050 BSC
0.002
0.006
0.014
0.018
0.002
0.006
0.014
0.018
0.137
0.145
0.063
-
0°
12°
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb,100%Sn).
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
8
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Copyright
©
ANPEC Electronics Corp.
Rev. A.1 - Jun., 2006
H
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
