APX9131A
Classification Reflow Profiles
Profile Feature
Preheat & Soak
Temperature min (T
smin
)
Temperature max (T
smax
)
Time (T
smin
to T
smax
) (t
s
)
Average ramp-up rate
(T
smax
to T
P
)
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
Peak
(T
p
)*
package
body
Temperature
Sn-Pb Eutectic Assembly
100
°C
150
°C
60-120 seconds
3
°C/second
max.
183
°C
60-150 seconds
See Classification Temp in table 1
20** seconds
6
°C/second
max.
6 minutes max.
Pb-Free Assembly
150
°C
200
°C
60-120 seconds
3°C/second max.
217
°C
60-150 seconds
See Classification Temp in table 2
30** seconds
6
°C/second
max.
8 minutes max.
Time (t
P
)** within 5°C of the specified
classification temperature (T
c
)
Average ramp-down rate (T
p
to T
smax
)
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (T
p
) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t
p
) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5
mm
3
Volume mm
<350
235
°C
220
°C
3
Volume mm
≥350
220
°C
220
°C
3
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5
mm
Volume mm
<350
260
°C
260
°C
250
°C
Volume mm
350-2000
260
°C
250
°C
245
°C
Volume mm
>2000
260
°C
245
°C
245
°C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
ESD
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ 125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV, VMM≧200V
10ms, 1
tr
≧100mA
Copyright
©
ANPEC Electronics Corp.
Rev. A.2 - Apr., 2009
11
www.anpec.com.tw
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
