APX9267
Reflow Condition
T
P
(IR/Convection or VPR Reflow)
tp
Critical Zone
T
L
to T
P
Ramp-up
T
L
Temperature
t
L
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25
°
C to Peak
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Time
Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1
tr
> 100mA
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(T
L
to T
P
)
Preheat
-
Temperature Min (Tsmin)
-
Temperature Max (Tsmax)
-
Time (min to max) (ts)
Time maintained above:
-
Temperature (T
L
)
-
Time (t
L
)
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
See table 1
10-30 seconds
6°C/second max.
6 minutes max.
Pb-Free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
See table 2
20-40 seconds
6°C/second max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright
©
ANPEC Electronics Corp.
Rev. A.6 - Mar., 2008
11
www.anpec.com.tw
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
