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INTRODUCTION
This easy-to-use kit provides a platform for the evaluation of
power op amps using the PA04 pin-out configuration. It can be
used to analyze a multitude of standard or proprietary circuit
configurations, and is flexible enough to do most standard
amplifier test configurations.
The schematic of the PC board is shown in Figure 2. Note
that all of the components shown on the schematic will probably
not be used for any single circuit. The component locations on
the PC board (See Figure 3) provide maximum flexibility for a
variety of configurations. Also included are loops for current
probes as well as connection pads on the edge of the PC board
for easy interconnects.
The hardware required to mount the PC board and the device
under evaluation to the heatsink are included in the kit. Because
of the limitless combination of configurations and component
values that can be used, no other parts are included in this kit.
However, generic formulas and guidelines are included in the
APEX DATABOOK.
• Initially set all power supplies to the minimum operating levels
allowed in the device data sheet.
• Check for oscillations.
• Always use the heatsink included in this kit with thermal
grease or TW05 and torque the part to the specified 8-10 in-lbs
(.90-1.13 N•M).
• Do not change connections while the circuit is under pow-
er.
• Never exceed any of the absolute maximums listed in the
device data sheet.
• Always use adequate power supply bypassing.
• Remember that internal power does not equal load power.
• Do not count on internal diodes to protect the output against
sustained, high frequency, high energy kickback pulses.
ASSEMBLY
1. Insert a #6 x 1/4" hex nut in each of the nut socket recesses
located on the bottom of the mating socket.
2. Insert the socket into the PC board until it is firmly pressed
against the ground plane side of the PC board.
3. Solder the socket in place (Figure 1). Be sure the nuts are
in the recesses prior to soldering.
4. Mount the PC board assembly to the heatsink using the
stand-offs and spacers included.
5. Apply thermal grease or a TW05 to the bottom of the device
under evaluation. Insert into the mating socket through the
heatsink.
6. Use the #6 x 1.25" panhead screws to mount the amplifier to
the heat sink. Do not overtorque. Recommended mounting
torque is 8-10 in-lbs (.90-1.13 N•M).
7. On the ground plane side of the board, between termina-
tions for –V and OUT, scrape off the green solder mask for
a ground connection. Connect the power supply common
in this area. If using the onboard Vboost generation circuits,
connect J3 to this ground also. If desired, the green solder
mask may be scrapped away on the other end of the board
for low current input signal ground connections also.
Mounting precautions, general operating considerations, and
heatsinking information may be found in the APEX DATA-
BOOK.
NOTE:
Refer to HS11 in Accessories Section.
ASSEMBLY HINTS
The mating socket included with this kit has recessed nut
sockets for mounting the device under evaluation. This al-
lows assembly from one side of the heatsink, making it easy
to swap devices under evaluation. The sizes of the stand-offs
were selected to allow proper spacing of the board-to-heatsink
and allow enough height for components when the assembly
is inverted.
PARTS LIST
Part #
HS11
EVAL04
MS05
HWRE01
TW05
Description
Heatsink
PC Board
Mating Socket
Hardware Kit
Thermal Washer
Quantity
1
1
1
1
1
HWRE01 contains the following:
4 #8 Panhead Screws
4 #6 x 1.25" Panhead Screws
4 #8 .375" Hex Spacers
4 #6 x 5/16" Hex Nuts
4 #8 1.00" Hex Stand Offs 2 #6 x 1/4" Hex Nuts
BEFORE YOU GET STARTED
• All Apex amplifiers should be handled using proper ESD
precautions!
FIGURE 1.
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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
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