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INTRODUCTION
This easy-to-use kit provides a platform for the evaluation
of power op amps that use the PA74 pin-out configuration. It
can be used to analyze a multitude of standard or proprietary
circuit configurations. In addition, it is flexible enough to do most
standard amplifier test configurations.
The schematic for 1/2 of the PC board is shown in Figure 2.
The schematic for the other half is identical except part refer-
ence designators are primed (i.e. R1 = R1'). Note that all of
the components shown on the schematic will probably not be
used for any single circuit. The component locations on the PC
board (See Figure 3) provide maximum flexibility for a variety
of configurations. Also included are loops for current probes as
well as connection pads on the edge of the PC board for easy
interconnects.
The hardware required to mount the PC board and the device
under evaluation to the heatsink are included in the kit. Because
of the limitless combination of configurations and component
values that can be used, no other parts are included in this kit.
However, generic formulas and guidelines are included in the
APEX DATABOOK and this evaluation kit documentation.
PARTS LIST
Part #
HS11
EVAL02
MS03
HWRE01
TW03
Description
Heatsink
PC Board
Mating Socket
Hardware Kit
Thermal Washer
Quantity
1
1
2
1
1 Box/10
HWRE01 contains the following:
4 #8 Panhead Screw
4 #6 x 1.25" Panhead Screw
4 #8 .375" Hex Spacer
4 #6 x 5/16" Hex Nut
4 #8 1.00" Hex Standoff
2 #6 x 1/4" Hex Nut
ASSEMBLY HINTS
The mating sockets included with this kit have recessed
nut sockets for mounting the device under evaluation. This
allows assembly from one side of the heatsink, making it easy
to swap devices under evaluation. The sizes of the stand-offs
were selected to allow proper spacing of the board-to-heatsink
and allow enough height for components when the assembly
is inverted.
BEFORE YOU GET STARTED
• All Apex amplifiers should be handled using proper ESD
precautions!
• Initially set all power supplies to the minimum operating levels
allowed in the device data sheet.
• Check for oscillations.
• Always use the heatsink included in this kit with thermal grease
or a TW03 and torque the part to the specified 4-7 in-lbs
(.45-.79 N•M).
• Do not change connections while the circuit is under pow-
er.
• Never exceed any of the absolute maximums listed in the
device data sheet.
• Always use adequate power supply bypassing.
• Remember that internal power does not equal load power.
• Do not count on internal diodes to protect the output against
sustained, high frequency, high energy kickback pulses.
Figure 1
ASSEMBLY
1. Insert a #6 x 5/16" hex nut in each of the nut socket recesses
located on the bottom of the mating socket.
2. Insert the socket into the pc board until it is firmly pressed
against the ground plane side of the pc board.
3. Solder the socket in place (see Figure 1). Be sure the nuts
are in the recesses prior to soldering.
4. Mount the PC board assembly to the heatsink using the
stand-offs and spacers included.
5. Apply thermal grease or a TW03 to the bottom of the device
under evaluation. Insert into the mating socket through the
heatsink.
6. Use the #6 x 1.25" panhead screws to mount the amplifier to
the heat sink. Do not overtorque. Recommended mounting
torque is 4-7 in-lbs (.45-.79 N•M).
Mounting precautions, general operating considerations,
and heatsinking information may be found in the APEX DATA
BOOK.
NOTE:
Refer to HS11 Heatsink in Accessories section
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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
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