ASM3112C/4112C
1.4 Bonding Diagram
19
RC3
18
RC2
17
RC1
16
RC0
15
GND2
14
13
12
OSC
VDD2 TEST
( 128K x 10-bit ) Block ROM
ASM3112C/4112C
RA3 RA2
RA1 RA0 VDD1 COUT GND1 RB0
RB1
RB2
RB3
1
2
3
4
5
6
7
8
9
10
11
Substrate must be connected to GND.
ASM3112C/4112C
Pad Location
PAD # PAD Name
X
1
RA3
-682.16
2
RA2
-559.84
3
RA1
-437.52
4
RA0
-315.2
5
VDD1
-191.28
6
COUT
71.12
7
GND1
189.52
8
RB0
307.92
9
RB1
430.24
10
RB2
552.56
Y
-1040.2
-1040.2
-1040.2
-1040.2
-1040.2
-1040.2
-1040.2
-1040.2
-1040.2
-1040.2
Chip Size: X=1540+100
PAD # PAD Name
11
RB3
12
OSC
13
TEST
14
VDD2
15
GND2
16
RC0
17
RC1
18
RC2
19
RC3
(um), Y=2320+100 (um)
X
Y
667.68
-1040.2
633.56
1071.52
432.48
1071.52
273.16
1071.52
134.68
1071.52
-51.76
1071.52
-248.4
1071.52
-454.24
1071.52
-650.88
1071.52
5
Rev 1.0
APLUS [ APLUS INTERGRATED CIRCUITS ]
