ASM8412CA
1.4 Bonding Diagram
19
RC3
18
RC2
17
RC1
16
RC0
15
GND2
14
VDD2
13
TEST
12
AOSC
( 256K x 10-bit ) Block ROM
ASM8412CA
RA3 RA2
RA1 RA0 VDD1 COUT GND1 RB0
RB1
RB2
RB3
1
2
3
4
5
6
7
8
9
10
11
ASM8412CA Pad Location
PAD #
1
2
3
4
5
6
7
8
9
10
PAD Name
RA3
RA2
RA1
RA0
VDD1
COUT
GND1
RB0
RB1
RB2
X
Y
-682.16
-559.84
-437.52
-315.2
-191.28
71.12
189.52
307.92
430.24
552.56
-1575.24
-1575.24
-1575.24
-1575.24
-1575.24
-1575.24
-1575.24
-1575.24
-1575.24
-1575.24
Chip Size: X=1540+100 (um), Y=3390+100 (um)
PAD # PAD Name
X
Y
11
RB3
667.68
-1575.24
12
AOSC
633.56
1606.56
13
TEST
432.48
1606.56
14
15
16
17
18
19
VDD2
GND2
RC0
RC1
RC2
RC3
273.16
134.68
-51.76
-248.4
-454.24
-650.88
1606.56
1606.56
1606.56
1606.56
1606.56
1606.56
5
Rev 1.0