SOIC-to-JEDEC TO Adapter
FEATURES
• 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin
footprint on the bottom. IC now available only in 8-position SOIC packages, can be
readily mounted on boards having JEDEC TO thru-hole footprints without having to
redesign the board.
• Consult factory for mounting of consigned chips.
GENERAL SPECIFICATIONS
• ADAPTER BOARD: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces both sides
• MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ
[2.54µ] Ni per SAE-AMS-QQ-N-290
• OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
DIP-to-TO ADAPTER ALSO AVAILABLE. CONSULT
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
P/N
1109814
08-301296-10
08-305479-10
Dim “C”
0.200[5.08]
0.300[7.62]
0.270[6.85]
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18013
Rev. AA
ARIES [ ARIES ELECTRONICS, INC. ]
