P/N 1111841-X 0.5mm 8- and 10-Pin
MSOP-to-0.300" DIP Adapter
FEATURES
• A cost-effective means of upgrading to MSOP 0.5mm package SOIC without
changing your PCB layout.
• Available on 0.300 [7.62] centers.
GENERAL SPECIFICATIONS
• BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ]
Ni per SAE AMS-QQ-N-290
• OPERATING TEMPERATURE: 221ºF [105ºC]
MOUNTING CONSIDERATIONS
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
ORDERING INFORMATION
1111841-8
= 8-Pin
1111841-8-P
= Panelized Version
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18067
Rev. AA
ARIES [ ARIES ELECTRONICS, INC. ]
