P/N 95-132I25 JEDEC 132-Position
QFP-to-PGA Adapter 0.025 [0.64] Pitch
FEATURES
• Convert surface-mount QFP packages to a 13x13 PGA footprint.
• Reduce costs by using less-expensive QFP packages to replace PGA footprints in
existing designs.
• Pins are mechanically fastened and soldered to board using Aries patented process,
creating a reliable electrical connection and rugged contact.
• Consult factory for Panelized Form or for mounting of consigned chips.
GENERAL SPECIFICATIONS
• ADAPTOR BODY: FR-4 with 1-oz. Cu traces
• PADS: Bare Cu protected with Entek
®
by Enthone or immersion white Sn to
eliminate coplanarity concerns and solder bridges associated with hot air solder
leveling
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ]
Ni per SAE AMS-QQ-N-290
• OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
P/N 95132125
QFP-to-PGA 13x13 Adapter
P/N 995132125-P
QFP-to-PGA 13x13
Panilized Form
P/N 132PGM13072-30
QFP-to-PGA 13x13
Wire Wrap
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
• Will plug into standard PGA socket
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ROW-TO-ROW AND PIN-TO-PIN ±0.003 [±0.08]
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18017
Rev. AA
ARIES [ ARIES ELECTRONICS, INC. ]
