Series 505 PLCC-to-PGA JEDEC
Type 0.050 [1.27] Pitch Adapter
FEATURES
• Convert surface mount PLCC packages to a PGA footprint
• Pin polarization option also available
• Consult factory for Panelized Form or for mounting of consigned chips
GENERAL SPECIFICATIONS
• ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces
• PADS: hot-air solder leveled
• PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni
per ASE AMS-QQ-N-290 or 10µ [0.25µ] Au
• OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia
• STANDARD: will plug into PGA socket
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
ORDERING INFORMATION
XX-505-11 X X
No. of Pins
28, 44, 52, 68, 84
or 29, 45, 53, 69, 85
with Polarization Pin
Series
Stand-offs w/Solder Pin Tail
Optional Panelized Version
Pin Plating
0 = Sn (standard)
1 = Au
# Pins
28 or 29
44 or 45
52 or 53
68 or 69
84 or 85
Dim. “A”
0.600 [15.24]
0.800 [20.32]
0.875 [22.23]
1.100 [27.94]
1.300 [33.02]
Dim. “B”
0.500 [12.70]
0.700 [17.78]
0.775 [19.69]
1.000 [25.40]
1.200 [30.48]
Dim. “C”
0.448 [11.38]
Dim. “D”
0.324 [8.23]
Matching PGA P/N
29-PGM06002-30
44-PGM08002-30
52-PGM09018-30
68-PGM11032-30
84-PGM13042-30
0.648 [16.46] 0.524 [13.31]
0.760 [19.30] 0.625 [15.88]
0.948 [24.08] 0.824 [20.93]
1.148 [29.16] 1.024 [26.01]
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18028
Rev. AA
ARIES [ ARIES ELECTRONICS, INC. ]
