P/N 97-68340 for Motorola 68340
144-Pin QFP-to-PGA Adapter
FEATURES
• Convert surface mount QFP packages to a 15x15 PGA footprint
• Reduce costs by using less expensive QFP packages to replace PGA footprints in
existing designs
• Pins are mechanically fastened and soldered to board using Aries’ patented process,
creating a reliable electrical connection and rugged contact
• Consult factory for panelized form or for mounting of consigned chips
GENERAL SPECIFICATIONS
• ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces
• PADS: bare Cu protected with ENIG or immersion white Sn to eliminate copla-
narity concerns and solder bridges associated with hot air solder leveling
• PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
• PIN PLATING: 200μ [5.08μ] min. Sn per ASTM B 545 Type 1 or Sn/Pb 93/7 per
ASTM B 545 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290
• OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.062 ±0.003 [1.58 ±0.08] dia.
• Will plug into standard PGA sockets
CUSTOMIZATION:
In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
P/N 97-68340
P/N 97-68340-P for Panelized Form
P/N 145-PGM15024-30 for Wire Wrap PGA
Socket
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ROW-TO-ROW ±0.003 [±0.08]
PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18025
Rev. AA
ARIES [ ARIES ELECTRONICS, INC. ]
