plerow
TM
APM2017-P29
Low Noise & High OIP3
Medium Power Amplifier Module
Features
·
S
21
= 33.3 dB @ 2010 MHz
= 32.7 dB @ 2025 MHz
·
NF of 2.0 dB over Frequency
·
Unconditionally Stable
·
Single 5V Supply
·
High OIP3 @ Low Current
Description
The plerow
TM
APM-Series is an internally matched
amplifier mini-module for such application band in
SMD package with the output P1dB of 29 dBm. It is
compactly designed for low current consumption and
high OIP3. Integrating all the components for biasing
and matching within the module enhances production
yield and throughput as well. It passes through the
stringent DC, RF, and reliability tests. Not sample test
but 100% quality control test is made before packing.
Specifications (in Production)
Typ. @ T = 25°C, V
s
= 5 V, Freq. = 2017 MHz, Z
o.sys
= 50 ohm
Parameter
Frequency Range
Gain
Gain Flatness
Noise Figure
Output IP3
S11 / S22
(1)
(2)
Unit
MHz
dB
dB
dB
dBm
dB
dBm
Specifications
Min
2010
32
33
±
0.3
2.0
44
28
47
-18 / -10
29
-
460
5
50
C.W 23 ~ 25 (before fail)
Surface Mount Type, 13Wx13Lx3.8H
1
500
±
0.5
2.1
Typ
Max
2025
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Output P1dB
Switching Time
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
Package Type & Size
(3)
µsec
mA
V
Ω
dBm
mm
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 15 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V
S
.
Outline Drawing (Unit: mm)
plerow
APM2017-P29
ASB Inc.
(Top View)
Solder Stencil Area
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
+Vcc
Ground
(Side View)
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø0.3
plated thru holes to ground plane
2 x
Ø2.0
plated thru holes to screw on heat sinker
(Recommended Footprint)
1/5
www.asb.co.kr
February 2008
ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
