ASL331
Wideband Linear Push-pull Amplifier MMIC
Outline Drawing
Part No.
Dimensions (In mm)
Symbols
MIN
NOM
1.50
---
1.45
---
MAX
A
A1
A2
B
1.40
0.00
---
1.60
0.10
---
●
0.33
0.19
4.80
3.20
5.80
3.80
2.30
---
0.51
0.25
5.00
3.40
6.20
4.00
2.50
---
C
D
---
---
D2
E
E1
E2
e
3.30
6.00
3.90
2.40
1.27
---
L
y
0.40
---
1.27
0.10
8°
---
---
q
0°
|L1-L1’|
L1
---
---
1.04REF
0.12
Pin No.
Function
RF IN 1
NC
NC
RF IN 2
Pin No.
Function.
RF OUT 2
NC
NC
RF OUT 1
1
2
3
4
5
6
7
8
Note: 1. Backside metal paddle is RF and DC ground.
Mounting Recommendation (in mm)
Note: 1. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
2. To ensure reliable operation, device ground paddle-to-ground
pad soldering is critical.
3. Add mounting screws near the part to fasten the board to a
heat sinker. Ensure that the ground / thermal via region con-
tacts the heat sinker.
4. A proper heat dissipation path underneath the area of the
PCB for the mounted device is strictly required for proper
thermal operation. Damage to the device can result from in-
appropriate heat dissipation.
ESD Classification
HBM
Class 1B
Voltage Level: 550 V
Class A
MM
Voltage Level: 50 V
CAUTION: ESD-sensitive device!
Moisture Sensitivity Level (MSL)
Level 3 at 260°C reflow
2/6
ASB Inc. · sales@asb.co.kr
·
Tel: +82-42-528-7223
March 2012
ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
