MB1M THRU MB10M
Case Style MBM
FEATURES
♦
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
♦
This series is UL recognized under Component Index,
file number E181321
♦
Glass passivated chip junctions
♦
High surge overload rating: 35A peak
♦
Saves space on printed circuit board
♦
High temperature soldering guaranteed:
260°C/10 seconds, at 5 lbs. (2.3kg) tension
MECHANICAL DATA
Case:
Molded plastic body over passivated junctions
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Polarity:
Polarity symbols marked on body
Mounting Position:
Any
Weight:
0.078 ounce, 0.22 gram
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
MB1M
MB2M
MB4M
MB6M
MB8M
MB10M
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward output rectified
current at T
A
=30°C - on glass-epoxy P.C.B.
(NOTE 1)
on aluminum substrate
(NOTE 2)
Peak forward surge current 8.3msec. single half sine-
wave superimposed on rated load (JEDEC Method)
Rating for fusing (t<8.3ms
Maximum instantaneous forward voltage drop
per leg at 0.4A
Maximum DC reverse current at
rated DC blocking voltage per leg
Typical junction capacitance per leg
(NOTE 3)
Typical thermal resistance per leg
(NOTE 1)
(NOTE 1)
(NOTE 2)
VRRM
VRMS
VDC
I(AV)
1
100
70
200
2
200
140
200
4
400
280
400
6
600
420
600
0.5
0.8
35.0
5.0
1.0
5.0
500
13.0
20.0
85.0
70.0
8
800
560
800
10
1000 Volts
700 Volts
1000 Volts
Amp
I
FSM
I
2
t
V
F
Amps
A
2
sec
Volts
µA
pF
°C/W
°C
T
A
=25°C
T
A
=125°C
I
R
C
J
R
Θ
JL
R
Θ
JA
R
ΘJA
T
J
, T
STG
Operating junction and storage temperature range
-55 to +150
NOTES:
(1) On glass epoxy P.C.B. mounted on 0.05 x 0.05” (1.3 x 1.3mm) solder pads
(2) On aluminum substrate P.C.B. with an area of 0.8 x 0.8 x 0.25” (20 x 20 x 6.4mm) mounted
on 0.05 x 0.05” (1.3 x1.3mm) solder pad
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts