PB5006 thru PB5010
General Semiconductor
PowerBridge
®
FEATURES
• UL recognition file number E312394
(QQQX2) UL 1557 (see *)
• Enhanced high-current density single
in-line package
• Superior thermal conductivity
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
TYPICAL APPLICATIONS
General purpose use in AC/DC bridge full wave
rectification for switching power supply, home
appliances and white-goods applications.
MECHANICAL DATA
Case:
PB
Molding compound meets UL 94 V-0 flammability
rating
Base P/N-E3 - RoHS compliant, commercial grade
Terminals:
Matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
E3 suffix meets JESD 201 class 1A whisker test
Polarity:
As marked on body
Mounting Torque:
10 cm-kg (8.8 inches-lbs) max.
Recommended Torque:
5.7 cm-kg (5 inches-lbs)
~
+
~
-
-
~
~
+
Case Style PB
+
~
~
-
* Tested to UL standard for safety electrically isolated semiconductor
devices. UL 1557 4
th
edition.
Dielectric tested to maximum case, storage and junction
temperature to 150 °C to withstand 1500 V.
Epoxy meets UL 94 V-0 flammability rating.
PRIMARY CHARACTERISTICS
I
F(AV)
V
RRM
I
FSM
I
R
V
F
at I
F
= 22.5 A
T
J
max.
45 A
600 V, 800 V, 1000 V
450 A
10 µA
0.90 V
150 °C
MAXIMUM RATINGS
(T
A
= 25 °C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Average rectified forward current (Fig. 1, 2)
Non-repetitive peak forward surge current
8.3 ms single sine-wave, T
J
= 25 °C
Rating for fusing (t < 8.3 ms) T
J
= 25 °C
Operating junction and storage temperature range
Notes
With heatsink
(2)
Without heatsink, free air
(1)
SYMBOL
V
RRM
T
C
= 84 °C
(1)
T
A
= 25 °C
(2)
I
O
I
FSM
I
2
t
T
J
, T
STG
PB5006
600
PB5008
800
45
4.5
450
840
- 55 to + 150
PB5010
1000
UNIT
V
A
A
A
2
s
°C
ASEMI [ 台湾ASEMI ]
