Solder Reflow Temperature Profile
Temperature (°C)
30 seconds
250°C
217°C
200°C
260°C (Peak Temperature)
1. One-time soldering reflow is recommended within
the condition of temperature and time profile shown
at right.
2. When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package
of the device within the condition of (1) above.
150°C
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
Note: Non-halide flux should be used.
Absolute Maximum Ratings
Storage Temperature, T
S
Operating Temperature, T
A
Lead Solder Temperature, max.
(1.6 mm below seating plane)
Average Forward Current, I
F
Reverse Input Voltage, V
R
Input Power Dissipation, P
I
Collector Current, I
C
Collector-Emitter Voltage, V
CEO
Emitter-Collector Voltage, V
ECO
Collector-Base Voltage, V
CBO
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage, V
iso
(AC for 1 minute, R.H. = 40 ~ 60%)
–55˚C to +150˚C
–55˚C to +100˚C
260˚C for 10 s
80 mA
6V
150 mW
100 mA
30 V
7V
70 V
150 mW
250 mW
2500 Vrms
4
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
