AEDR-8400-140 and AEDR-8400-142
Reflective Surface Mount Optical Encoder
Reliability Data Sheet
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies Malaysia
in accordance with the latest revisions of JEDEC Standard.
Avago tests parts at the absolute maximum rated condi-
tions recommended for the device. The actual perfor-
mance you obtain from Avago parts depends on the
electrical and environmental characteristics of your appli-
cation but will probably be better than the performance
outlined in Table 1.
Failure Rate Prediction
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relation-
ship between ambient given by the following:
T
J
(°C) = T
A
(°C) +
q
JA
P
AVG
Where,
T
A
= ambient temperature in
°C
q
JA
= thermal resistance of junction-to-ambient in
°C/
Watt
P
AVG
= average power dissipated in Watt
The estimated MTTF and failure rate at temperatures
lower than the actual stress temperature can be deter-
mined by using an Arrhenius model for temperature
acceleration. Results of such calculations are shown in
the table below using an activation energy of 0.43eV
(reference MIL-HDBK-217).
Table 1. Life Tests
Demonstrated Performance
Point Typical Performance
Test Name
High Temperature
Operating Life
Stress Test
Conditions
V
CC
=3.0V, T
A
=85°C,
1500hours
Total Device
Hours
45,000
Units
Tested
30
Total
Failed
0
MTTF
49,180
Failure Rate
(% /1 K Hours)
2.03
Table 2.
Ambient
Temperature
(°C)
85
75
65
55
45
35
25
Junction
Temperature
(°C)
89.7
79.7
69.7
59.7
49.7
39.7
29.7
Point Typical Performance
[1]
in Time
MTTF
[1]
49,180
72,640
109,800
170,000
270,700
443,800
751,900
Failure Rate
(% / 1K Hours)
2.03
1.38
0.91
0.59
0.37
0.23
0.13
Performance in Time
[2]
(90% Confidence)
MTTF
[2]
19,520
28,840
43,580
67,500
107,400
176,200
298,500
Failure Rate
(% /1K Hours)
5.12
3.47
2.29
1.48
0.93
0.57
0.34
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
