Recommended Land Pattern
Note:
The additional solder resist is to improve heat dissipation.
The bigger the surface area, the better is the thermal dis-
sipation. The surface area depends on the substrate and
total power used. If MC (Metal Core) PCB is used, the ad-
ditional area will not be needed as the whole MC PCB
conducts heat.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-027EN - April 27, 2007
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
