Absolute Maximum Ratings, T
A
= 25ºC
Symbol
I
F
I
F- peak
P
T
P
INV
T
J
T
STG
θ
JC
Parameter
DC Forward Current
Peak Surge Current (1µs pulse)
Total Power Dissipation
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance, junction to lead
Unit
mA
A
mW
V
°C
°C
°C/W
Absolute Maximum
[1]
HBAT-5400/-5402
0
1.0
50
30
150
-65 to 150
500
HBAT-540B/-540C
430
1.0
85
30
150
-65 to 150
150
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
Linear and Non-linear SPICE Model
[2]
0.08 pF
SPICE Parameters
Parameter
BV
CJO
EG
IBV
IS
N
RS
PB
PT
M
Unit
V
pF
eV
A
A
Ω
V
Value
40
3.0
0.55
10E-4
1.0E-7
1.0
.4
0.6
0.5
2 nH
R
S
SPICE model
Note:
. To effectively model the packaged HBAT-540x product, please refer to
Application Note AN114.
HBAT-540x DC Electrical Specifications, T
A
= +25°C
[1]
Part
Number
HBAT-Code
[2]
Package
Marking
Lead
Code Configuration
V0
V
0
B
C
Maximum
Forward
Voltage
V
BR
(V)
Minimum
Breakdown
Voltage
C
T
(pF)
Typical
Capacitance
R
S
(Ω)
Typical
Series
Resistance
t (ps)
Maximum
Eff. Carrier
Lifetime
Package
Single
Series
V
F
(mV)
SOT-3
SOT-33
(3-lead SC-70)
SOT-3
SOT-33
(3-lead SC-70)
-5400
-540B
-540
-540C
800
[3]
30
[4]
3.0
[5]
.4
100
[6]
Notes:
1. T = +5°C, where T
A
is defined to be the temperature at the package pins where contact is made to the circuit board.
A
. Package marking code is laser marked.
3. I
F
= 100 mA; 100% tested
4. I
R
= 100 µA; 100% tested
5. V
F
= 0; f =1 MHz
6. Measured with Karkauer method at 0 mA guaranteed by design.