Solder Reflow Temperature Profile
300
PREHEATING RATE 3
°
C + 1
°
C/-0.5
°
C/SEC.
REFLOW HEATING RATE 2.5
°
C ± 0.5
°
C/SEC.
PEAK
TEMP.
245
°
C
PEAK
TEMP.
240
°
C
200
TEMPERATURE (
°
C)
160
°
C
150
°
C
140
°
C
3
°
C + 1
°
C/-0.5
°
C
PEAK
TEMP.
230
°
C
2.5
°
C ± 0.5
°
C/SEC.
30
SEC.
30
SEC.
SOLDERING
TIME
200
°
C
100
PREHEATING TIME
150
°
C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
TIME (SECONDS)
150
200
250
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60to180SEC.
25
t
L
60 to 150 SEC.
260 +0/-5
°
C
217
°
C
150 - 200
°
C
RAMP-UP
3
°
C/SEC. MAX.
RAMP-DOWN
6
°
C/SEC. MAX.
TIMEWITHIN 5
°
C of ACTUAL
PEAKTEMPERATURE
20-40 SEC.
t 25
°
C to PEAK
TIME
NOTES:
THE TIME FROM 25
°
C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200
°
C, T
smin
= 150
°
C
Note: Non-halide flux should be used.
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL Approval under UL 1577, Component Recognition Program, File E55361.
CSA Approval under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (Option 060 only)
5
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