Solder Reflow Temperature Profile
300
PREHEATING RATE 3
°C
+ 1
°C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5
°C
± 0.5
°C/SEC.
PEAK
TEMP.
245
°C
PEAK
TEMP.
240
°C
200
TEMPERATURE (°C)
160
°C
150
°C
140
°C
3
°C
+ 1
°C/–0.5 °C
100
2.5 C ± 0.5
°C/SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
230
°C
SOLDERING
TIME
200
°C
PREHEATING TIME
150
°C,
90 + 30 SEC.
ROOM
TEMPERATURE
0
0
50
100
TIME (SECONDS)
NOTE: NON-HALIDE FLUX SHOULD BE USED.
150
50 SEC.
TIGHT
TYPICAL
LOOSE
200
250
Recommended Pb-Free IR Profile
TIME WITHIN 5
°C
of ACTUAL
PEAK TEMPERATURE
15 SEC.
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t
L
* 260 +0/-5
°C
217
°C
150 - 200
°C
RAMP-UP
3
°C/SEC.
MAX.
RAMP-DOWN
6
°C/SEC.
MAX.
60 to 150 SEC.
t 25
°C
to PEAK
TIME
NOTES:
THE TIME FROM 25
°C
to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200
°C,
T
smin
= 150
°C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245
°C
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
